Dolphin Design announces successful wafer fabrication of the first silicon wafer to support 12 nanometer FinFet technology

This test chip is the industry's first product to provide a complete solution for audio IP using 12 nanometer FinFet (FF) technology. This chip perfectly combines high performance, low power consumption, and optimized footprint, providing excellent sound quality and functionality for battery powered applications. This dedicated testing chip strengthens customer confidence in Dolphin Design products by accelerating the product launch process, providing the best performance in its class, and ensuring robust product design, once again confirming Dolphin Design's industry-leading position in the mixed signal IP field.

 

On February 22, 2024, in Grenoble, France, Dolphin Design, a leading supplier of high-performance simulation, mixed signal, processing intellectual property (IP), and ASIC design, successfully fabricated the first 12 nanometer FinFet test chip containing the most advanced audio IP, achieving a significant milestone.

Creating dedicated testing chips is a crucial step for Dolphin Design to establish a leading position in power management and audio IP, helping to continuously improve its product performance and quality. Dolphin Design continuously improves the professional level of advanced processes used by customers, as this was previously achieved on 22 nanometer node technology. When designing new IPs or migrating, describing and mastering the process can ensure the optimal performance of the chip.

The insights gained by Dolphin Design from testing chip development have played a crucial role in aligning with the company's proactive performance roadmap. These gains can ensure the sustained development of IP and meet the growing demand for performance and low power consumption.